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Commit 6cfdeb99 authored by Xiaowen Wu's avatar Xiaowen Wu
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dt-bindings: drm: msm: add bond mode option 



Add bond mode option to specify which two or three DP controllers
can work in bond mode.

Change-Id: I26b0fedd3d861deafae76f6bdda7bddc74ac5363
Signed-off-by: default avatarXiaowen Wu <wxiaowen@codeaurora.org>
Signed-off-by: default avatarJim Wang <jimwan@codeaurora.org>
parent 29ab6ce9

Documentation/devicetree/bindings/drm/msm/sde-dp.txt

+8 −0
Original line number Diff line number Diff line
@@ -121,6 +121,14 @@ Optional properties: 
- qcom,dp-aux-bridge:		phandle for dp aux bridge module, for 3rd party dp bridge only.

- qcom,dp-aux-bridge-sim:	phandle for dp aux bridge module, for internal mst debug simulation only.

- qcom,dp-force-bond-mode:	Ignore tile information from EDID and force DP to work in bond mode.

- qcom,bond-dual-ctrl:		u32 array to specify the cell-index of the two DP controllers that support bond mode.

				The first controller in the array is the bond master. Driver will switch to bond mode

				if both DP controllers are connected to the same dual DP input monitor.

				e.g. <1, 0> will bond DP0 and DP1, and DP1 is the master, and DP0 is the salve.

- qcom,bond-tri-ctrl:		u32 array to specify the cell-index of the three DP controllers that support bond mode.

				The first controller in the array is the bond master. Driver will switch to bond mode

				if all three DP controllers are connected to the same triple DP input monitor.

				e.g. <2, 0, 1> will bond DP0, DP1 and DP2 together, and DP2 is the master, DP0/DP1 are the slaves.



[Optional child nodes]: These nodes are for devices which are

dependent on msm_ext_disp. If msm_ext_disp is disabled then