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Commit 50851c62 authored by Linus Torvalds's avatar Linus Torvalds
Browse files

Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux 

Pull thermal management update from Zhang Rui:
 "Highlights:

   - Introduction of thermal policy support, together with three new
     thermal governors, including step_wise, user_space, fire_share.

   - Introduction of ST-Ericsson db8500_thermal driver and ST-Ericsson
     db8500_cpufreq_cooling driver.

   - Thermal Kconfig file and Makefile refactor.

   - Fixes for generic thermal layer, generic cpucooling, rcar thermal
     driver and Exynos thermal driver."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  Thermal: Fix DEFAULT_THERMAL_GOVERNOR
  Thermal: fix a NULL pointer dereference when generic thermal layer is built as a module
  thermal: rcar: add rcar_zone_to_priv() macro
  thermal: rcar: fixup the unit of temperature
  thermal: cpu cooling: allow module builds
  thermal: cpu cooling: use const parameter while registering
  Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.
  Thermal: Add ST-Ericsson DB8500 thermal driver.
  drivers/thermal/Makefile refactor
  Exynos: Add missing dependency
  Refactor drivers/thermal/Kconfig
  thermal: cpu_cooling: Make 'notify_device' static
  Thermal: Remove the cooling_cpufreq_list.
  Thermal: fix bug of counting cpu frequencies.
  Thermal: add indent for code alignment.
  thermal: rcar_thermal: remove explicitly used devm_kfree/iounap()
  thermal: user_space: Add missing static storage class specifiers
  thermal: fair_share: Add missing static storage class specifiers
  thermal: step_wise: Add missing static storage class specifiers
  Thermal: Fix oops and unlocking in thermal_sys.c
  ...
parents 99b8f42e 1f53ef17

Documentation/devicetree/bindings/thermal/db8500-thermal.txt

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+44 −0
Original line number Diff line number Diff line 
* ST-Ericsson DB8500 Thermal



** Thermal node properties:



- compatible : "stericsson,db8500-thermal";

- reg : address range of the thermal sensor registers;

- interrupts : interrupts generated from PRCMU;

- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH";

- num-trips : number of total trip points, this is required, set it 0 if none,

  if greater than 0, the following properties must be defined;

- tripN-temp : temperature of trip point N, should be in ascending order;

- tripN-type : type of trip point N, should be one of "active" "passive" "hot"

  "critical";

- tripN-cdev-num : number of the cooling devices which can be bound to trip

  point N, this is required if trip point N is defined, set it 0 if none,

  otherwise the following cooling device names must be defined;

- tripN-cdev-nameM : name of the No. M cooling device of trip point N;



Usually the num-trips and tripN-*** are separated in board related dts files.



Example:

thermal@801573c0 {

	compatible = "stericsson,db8500-thermal";

	reg = <0x801573c0 0x40>;

	interrupts = <21 0x4>, <22 0x4>;

	interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";



	num-trips = <3>;



	trip0-temp = <75000>;

	trip0-type = "active";

	trip0-cdev-num = <1>;

	trip0-cdev-name0 = "thermal-cpufreq-0";



	trip1-temp = <80000>;

	trip1-type = "active";

	trip1-cdev-num = <2>;

	trip1-cdev-name0 = "thermal-cpufreq-0";

	trip1-cdev-name1 = "thermal-fan";



	trip2-temp = <85000>;

	trip2-type = "critical";

	trip2-cdev-num = <0>;

}

Documentation/thermal/sysfs-api.txt

+64 −0
Original line number Diff line number Diff line
@@ -112,6 +112,29 @@ temperature) and throttle appropriate devices. 
    trip: indicates which trip point the cooling devices is associated with

	  in this thermal zone.



1.4 Thermal Zone Parameters

1.4.1 struct thermal_bind_params

    This structure defines the following parameters that are used to bind

    a zone with a cooling device for a particular trip point.

    .cdev: The cooling device pointer

    .weight: The 'influence' of a particular cooling device on this zone.

             This is on a percentage scale. The sum of all these weights

             (for a particular zone) cannot exceed 100.

    .trip_mask:This is a bit mask that gives the binding relation between

               this thermal zone and cdev, for a particular trip point.

               If nth bit is set, then the cdev and thermal zone are bound

               for trip point n.

    .match: This call back returns success(0) if the 'tz and cdev' need to

	    be bound, as per platform data.

1.4.2 struct thermal_zone_params

    This structure defines the platform level parameters for a thermal zone.

    This data, for each thermal zone should come from the platform layer.

    This is an optional feature where some platforms can choose not to

    provide this data.

    .governor_name: Name of the thermal governor used for this zone

    .num_tbps: Number of thermal_bind_params entries for this zone

    .tbp: thermal_bind_params entries



2. sysfs attributes structure



RO	read only value
@@ -126,6 +149,7 @@ Thermal zone device sys I/F, created once it's registered: 
    |---type:			Type of the thermal zone

    |---temp:			Current temperature

    |---mode:			Working mode of the thermal zone

    |---policy:			Thermal governor used for this zone

    |---trip_point_[0-*]_temp:	Trip point temperature

    |---trip_point_[0-*]_type:	Trip point type

    |---trip_point_[0-*]_hyst:	Hysteresis value for this trip point
@@ -187,6 +211,10 @@ mode 
			  charge of the thermal management.

	RW, Optional



policy

	One of the various thermal governors used for a particular zone.

	RW, Required



trip_point_[0-*]_temp

	The temperature above which trip point will be fired.

	Unit: millidegree Celsius
@@ -264,6 +292,7 @@ method, the sys I/F structure will be built like this: 
    |---type:			acpitz

    |---temp:			37000

    |---mode:			enabled

    |---policy:			step_wise

    |---trip_point_0_temp:	100000

    |---trip_point_0_type:	critical

    |---trip_point_1_temp:	80000
@@ -305,3 +334,38 @@ to a thermal_zone_device when it registers itself with the framework. The 
event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL,

THERMAL_DEV_FAULT}. Notification can be sent when the current temperature

crosses any of the configured thresholds.



5. Export Symbol APIs:



5.1: get_tz_trend:

This function returns the trend of a thermal zone, i.e the rate of change

of temperature of the thermal zone. Ideally, the thermal sensor drivers

are supposed to implement the callback. If they don't, the thermal

framework calculated the trend by comparing the previous and the current

temperature values.



5.2:get_thermal_instance:

This function returns the thermal_instance corresponding to a given

{thermal_zone, cooling_device, trip_point} combination. Returns NULL

if such an instance does not exist.



5.3:notify_thermal_framework:

This function handles the trip events from sensor drivers. It starts

throttling the cooling devices according to the policy configured.

For CRITICAL and HOT trip points, this notifies the respective drivers,

and does actual throttling for other trip points i.e ACTIVE and PASSIVE.

The throttling policy is based on the configured platform data; if no

platform data is provided, this uses the step_wise throttling policy.



5.4:thermal_cdev_update:

This function serves as an arbitrator to set the state of a cooling

device. It sets the cooling device to the deepest cooling state if

possible.



5.5:thermal_register_governor:

This function lets the various thermal governors to register themselves

with the Thermal framework. At run time, depending on a zone's platform

data, a particular governor is used for throttling.



5.6:thermal_unregister_governor:

This function unregisters a governor from the thermal framework.

arch/arm/boot/dts/dbx5x0.dtsi

+14 −0
Original line number Diff line number Diff line
@@ -203,6 +203,14 @@ 
				reg = <0x80157450 0xC>;

			};



			thermal@801573c0 {

				compatible = "stericsson,db8500-thermal";

				reg = <0x801573c0 0x40>;

				interrupts = <21 0x4>, <22 0x4>;

				interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";

				status = "disabled";

			 };



			db8500-prcmu-regulators {

				compatible = "stericsson,db8500-prcmu-regulator";
@@ -660,5 +668,11 @@ 
			ranges = <0 0x50000000 0x4000000>;

			status = "disabled";

		};



		cpufreq-cooling {

			compatible = "stericsson,db8500-cpufreq-cooling";

			status = "disabled";

		 };



	};

};

arch/arm/boot/dts/snowball.dts

+31 −0
Original line number Diff line number Diff line
@@ -99,6 +99,33 @@ 
			status = "okay";

		};



		prcmu@80157000 {

			thermal@801573c0 {

				num-trips = <4>;



				trip0-temp = <70000>;

				trip0-type = "active";

				trip0-cdev-num = <1>;

				trip0-cdev-name0 = "thermal-cpufreq-0";



				trip1-temp = <75000>;

				trip1-type = "active";

				trip1-cdev-num = <1>;

				trip1-cdev-name0 = "thermal-cpufreq-0";



				trip2-temp = <80000>;

				trip2-type = "active";

				trip2-cdev-num = <1>;

				trip2-cdev-name0 = "thermal-cpufreq-0";



				trip3-temp = <85000>;

				trip3-type = "critical";

				trip3-cdev-num = <0>;



				status = "okay";

			 };

		};



		external-bus@50000000 {

			status = "okay";
@@ -183,5 +210,9 @@ 
				reg = <0x33>;

			};

		};



		cpufreq-cooling {

			status = "okay";

		};

	};

};

arch/arm/configs/u8500_defconfig

+2 −0
Original line number Diff line number Diff line
@@ -69,6 +69,8 @@ CONFIG_GPIO_TC3589X=y 
CONFIG_POWER_SUPPLY=y

CONFIG_AB8500_BM=y

CONFIG_AB8500_BATTERY_THERM_ON_BATCTRL=y

CONFIG_THERMAL=y

CONFIG_CPU_THERMAL=y

CONFIG_MFD_STMPE=y

CONFIG_MFD_TC3589X=y

CONFIG_AB5500_CORE=y