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Commit 29b19e25 authored by Len Brown's avatar Len Brown
Browse files

Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal 



Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: default avatarStephen Rothwell <sfr@canb.auug.org.au>

Signed-off-by: default avatarLen Brown <len.brown@intel.com>
parents 125c4c70 c072fed9

Documentation/thermal/cpu-cooling-api.txt

0 → 100644
+32 −0
Original line number Diff line number Diff line 
CPU cooling APIs How To

===================================



Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>



Updated: 12 May 2012



Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)



0. Introduction



The generic cpu cooling(freq clipping) provides registration/unregistration APIs

to the caller. The binding of the cooling devices to the trip point is left for

the user. The registration APIs returns the cooling device pointer.



1. cpu cooling APIs



1.1 cpufreq registration/unregistration APIs

1.1.1 struct thermal_cooling_device *cpufreq_cooling_register(

	struct cpumask *clip_cpus)



    This interface function registers the cpufreq cooling device with the name

    "thermal-cpufreq-%x". This api can support multiple instances of cpufreq

    cooling devices.



   clip_cpus: cpumask of cpus where the frequency constraints will happen.



1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)



    This interface function unregisters the "thermal-cpufreq-%x" cooling device.



    cdev: Cooling device pointer which has to be unregistered.

Documentation/hwmon/exynos4_tmu→Documentation/thermal/exynos_thermal

+3 −32
Original line number Diff line number Diff line
@@ -46,36 +46,7 @@ The threshold levels are defined as follows: 
  The threshold and each trigger_level are set

  through the corresponding registers.



When an interrupt occurs, this driver notify user space of

one of four threshold levels for the interrupt

through kobject_uevent_env and sysfs_notify functions.

When an interrupt occurs, this driver notify kernel thermal framework

with the function exynos4_report_trigger.

Although an interrupt condition for level_0 can be set,

it is not notified to user space through sysfs_notify function.



Sysfs Interface

---------------

name		name of the temperature sensor

		RO



temp1_input	temperature

		RO



temp1_max	temperature for level_1 interrupt

		RO



temp1_crit	temperature for level_2 interrupt

		RO



temp1_emergency	temperature for level_3 interrupt

		RO



temp1_max_alarm	alarm for level_1 interrupt

		RO



temp1_crit_alarm

		alarm for level_2 interrupt

		RO



temp1_emergency_alarm

		alarm for level_3 interrupt

		RO
 
it can be used to synchronize the cooling action.

Documentation/thermal/sysfs-api.txt

+8 −1
Original line number Diff line number Diff line
@@ -84,7 +84,8 @@ temperature) and throttle appropriate devices. 


1.3 interface for binding a thermal zone device with a thermal cooling device

1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,

		int trip, struct thermal_cooling_device *cdev);

	int trip, struct thermal_cooling_device *cdev,

	unsigned long upper, unsigned long lower);



    This interface function bind a thermal cooling device to the certain trip

    point of a thermal zone device.
@@ -93,6 +94,12 @@ temperature) and throttle appropriate devices. 
    cdev: thermal cooling device

    trip: indicates which trip point the cooling devices is associated with

	  in this thermal zone.

    upper:the Maximum cooling state for this trip point.

          THERMAL_NO_LIMIT means no upper limit,

	  and the cooling device can be in max_state.

    lower:the Minimum cooling state can be used for this trip point.

          THERMAL_NO_LIMIT means no lower limit,

	  and the cooling device can be in cooling state 0.



1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,

		int trip, struct thermal_cooling_device *cdev);

drivers/acpi/thermal.c

+71 −22
Original line number Diff line number Diff line
@@ -708,6 +708,40 @@ static int thermal_get_crit_temp(struct thermal_zone_device *thermal, 
		return -EINVAL;

}



static int thermal_get_trend(struct thermal_zone_device *thermal,

				int trip, enum thermal_trend *trend)

{

	struct acpi_thermal *tz = thermal->devdata;

	enum thermal_trip_type type;

	int i;



	if (thermal_get_trip_type(thermal, trip, &type))

		return -EINVAL;



	if (type == THERMAL_TRIP_ACTIVE) {

		/* aggressive active cooling */

		*trend = THERMAL_TREND_RAISING;

		return 0;

	}



	/*

	 * tz->temperature has already been updated by generic thermal layer,

	 * before this callback being invoked

	 */

	i = (tz->trips.passive.tc1 * (tz->temperature - tz->last_temperature))

		+ (tz->trips.passive.tc2

		* (tz->temperature - tz->trips.passive.temperature));



	if (i > 0)

		*trend = THERMAL_TREND_RAISING;

	else if (i < 0)

		*trend = THERMAL_TREND_DROPPING;

	else

		*trend = THERMAL_TREND_STABLE;

	return 0;

}





static int thermal_notify(struct thermal_zone_device *thermal, int trip,

			   enum thermal_trip_type trip_type)

{
@@ -731,11 +765,9 @@ static int thermal_notify(struct thermal_zone_device *thermal, int trip, 
	return 0;

}



typedef int (*cb)(struct thermal_zone_device *, int,

		  struct thermal_cooling_device *);

static int acpi_thermal_cooling_device_cb(struct thermal_zone_device *thermal,

					struct thermal_cooling_device *cdev,

					cb action)

					bool bind)

{

	struct acpi_device *device = cdev->devdata;

	struct acpi_thermal *tz = thermal->devdata;
@@ -759,13 +791,21 @@ static int acpi_thermal_cooling_device_cb(struct thermal_zone_device *thermal, 
		    i++) {

			handle = tz->trips.passive.devices.handles[i];

			status = acpi_bus_get_device(handle, &dev);

			if (ACPI_SUCCESS(status) && (dev == device)) {

				result = action(thermal, trip, cdev);

			if (ACPI_FAILURE(status) || dev != device)

				continue;

			if (bind)

				result =

					thermal_zone_bind_cooling_device

					(thermal, trip, cdev,

					 THERMAL_NO_LIMIT, THERMAL_NO_LIMIT);

			else

				result =

					thermal_zone_unbind_cooling_device

					(thermal, trip, cdev);

			if (result)

				goto failed;

		}

	}

	}



	for (i = 0; i < ACPI_THERMAL_MAX_ACTIVE; i++) {

		if (!tz->trips.active[i].flags.valid)
@@ -776,19 +816,32 @@ static int acpi_thermal_cooling_device_cb(struct thermal_zone_device *thermal, 
		    j++) {

			handle = tz->trips.active[i].devices.handles[j];

			status = acpi_bus_get_device(handle, &dev);

			if (ACPI_SUCCESS(status) && (dev == device)) {

				result = action(thermal, trip, cdev);

			if (ACPI_FAILURE(status) || dev != device)

				continue;

			if (bind)

				result = thermal_zone_bind_cooling_device

					(thermal, trip, cdev,

					 THERMAL_NO_LIMIT, THERMAL_NO_LIMIT);

			else

				result = thermal_zone_unbind_cooling_device

					(thermal, trip, cdev);

			if (result)

				goto failed;

		}

	}

	}



	for (i = 0; i < tz->devices.count; i++) {

		handle = tz->devices.handles[i];

		status = acpi_bus_get_device(handle, &dev);

		if (ACPI_SUCCESS(status) && (dev == device)) {

			result = action(thermal, -1, cdev);

			if (bind)

				result = thermal_zone_bind_cooling_device

						(thermal, -1, cdev,

						 THERMAL_NO_LIMIT,

						 THERMAL_NO_LIMIT);

			else

				result = thermal_zone_unbind_cooling_device

						(thermal, -1, cdev);

			if (result)

				goto failed;

		}
@@ -802,16 +855,14 @@ static int 
acpi_thermal_bind_cooling_device(struct thermal_zone_device *thermal,

					struct thermal_cooling_device *cdev)

{

	return acpi_thermal_cooling_device_cb(thermal, cdev,

				thermal_zone_bind_cooling_device);

	return acpi_thermal_cooling_device_cb(thermal, cdev, true);

}



static int

acpi_thermal_unbind_cooling_device(struct thermal_zone_device *thermal,

					struct thermal_cooling_device *cdev)

{

	return acpi_thermal_cooling_device_cb(thermal, cdev,

				thermal_zone_unbind_cooling_device);

	return acpi_thermal_cooling_device_cb(thermal, cdev, false);

}



static const struct thermal_zone_device_ops acpi_thermal_zone_ops = {
@@ -823,6 +874,7 @@ static const struct thermal_zone_device_ops acpi_thermal_zone_ops = { 
	.get_trip_type = thermal_get_trip_type,

	.get_trip_temp = thermal_get_trip_temp,

	.get_crit_temp = thermal_get_crit_temp,

	.get_trend = thermal_get_trend,

	.notify = thermal_notify,

};
@@ -849,15 +901,12 @@ static int acpi_thermal_register_thermal_zone(struct acpi_thermal *tz) 
		tz->thermal_zone =

			thermal_zone_device_register("acpitz", trips, 0, tz,

						     &acpi_thermal_zone_ops,

						     tz->trips.passive.tc1,

						     tz->trips.passive.tc2,

						     tz->trips.passive.tsp*100,

						     tz->polling_frequency*100);

	else

		tz->thermal_zone =

			thermal_zone_device_register("acpitz", trips, 0, tz,

						     &acpi_thermal_zone_ops,

						     0, 0, 0,

						     &acpi_thermal_zone_ops, 0,

						     tz->polling_frequency*100);

	if (IS_ERR(tz->thermal_zone))

		return -ENODEV;

drivers/hwmon/Kconfig

+0 −10
Original line number Diff line number Diff line
@@ -334,16 +334,6 @@ config SENSORS_DA9052_ADC 
	  This driver can also be built as module. If so, the module

	  will be called da9052-hwmon.



config SENSORS_EXYNOS4_TMU

	tristate "Temperature sensor on Samsung EXYNOS4"

	depends on ARCH_EXYNOS4

	help

	  If you say yes here you get support for TMU (Thermal Management

	  Unit) on SAMSUNG EXYNOS4 series of SoC.



	  This driver can also be built as a module. If so, the module

	  will be called exynos4-tmu.



config SENSORS_I5K_AMB

	tristate "FB-DIMM AMB temperature sensor on Intel 5000 series chipsets"

	depends on PCI