Loading Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt +28 −4 Original line number Diff line number Diff line Loading @@ -7,11 +7,35 @@ compatible: should be one of: "brcm,bcm2835-thermal", "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal" reg: Address range of the thermal registers. clocks: Phandle of the clock used by the thermal sensor. #thermal-sensor-cells: should be 0 (see thermal.txt) Example: thermal-zones { cpu_thermal: cpu-thermal { polling-delay-passive = <0>; polling-delay = <1000>; thermal-sensors = <&thermal>; trips { cpu-crit { temperature = <80000>; hysteresis = <0>; type = "critical"; }; }; coefficients = <(-538) 407000>; cooling-maps { }; }; }; thermal: thermal@7e212000 { compatible = "brcm,bcm2835-thermal"; reg = <0x7e212000 0x8>; clocks = <&clocks BCM2835_CLOCK_TSENS>; #thermal-sensor-cells = <0>; }; Documentation/devicetree/bindings/thermal/brcm,ns-thermal 0 → 100644 +37 −0 Original line number Diff line number Diff line * Broadcom Northstar Thermal This binding describes thermal sensor that is part of Northstar's DMU (Device Management Unit). Required properties: - compatible : Must be "brcm,ns-thermal" - reg : iomem address range of PVTMON registers - #thermal-sensor-cells : Should be <0> Example: thermal: thermal@1800c2c0 { compatible = "brcm,ns-thermal"; reg = <0x1800c2c0 0x10>; #thermal-sensor-cells = <0>; }; thermal-zones { cpu_thermal: cpu-thermal { polling-delay-passive = <0>; polling-delay = <1000>; coefficients = <(-556) 418000>; thermal-sensors = <&thermal>; trips { cpu-crit { temperature = <125000>; hysteresis = <0>; type = "critical"; }; }; cooling-maps { }; }; }; Documentation/devicetree/bindings/thermal/da9062-thermal.txt 0 → 100644 +36 −0 Original line number Diff line number Diff line * Dialog DA9062/61 TJUNC Thermal Module This module is part of the DA9061/DA9062. For more details about entire DA9062 and DA9061 chips see Documentation/devicetree/bindings/mfd/da9062.txt Junction temperature thermal module uses an interrupt signal to identify high THERMAL_TRIP_HOT temperatures for the PMIC device. Required properties: - compatible: should be one of the following valid compatible string lines: "dlg,da9061-thermal", "dlg,da9062-thermal" "dlg,da9062-thermal" Optional properties: - polling-delay-passive : Specify the polling period, measured in milliseconds, between thermal zone device update checks. Example: DA9062 pmic0: da9062@58 { thermal { compatible = "dlg,da9062-thermal"; polling-delay-passive = <3000>; }; }; Example: DA9061 using a fall-back compatible for the DA9062 onkey driver pmic0: da9061@58 { thermal { compatible = "dlg,da9061-thermal", "dlg,da9062-thermal"; polling-delay-passive = <3000>; }; }; drivers/thermal/Kconfig +15 −0 Original line number Diff line number Diff line Loading @@ -320,6 +320,16 @@ config DB8500_CPUFREQ_COOLING bound cpufreq cooling device turns active to set CPU frequency low to cool down the CPU. config DA9062_THERMAL tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" depends on MFD_DA9062 || COMPILE_TEST depends on OF help Enable this for the Dialog Semiconductor thermal sensor driver. This will report PMIC junction over-temperature for one thermal trip zone. Compatible with the DA9062 and DA9061 PMICs. config INTEL_POWERCLAMP tristate "Intel PowerClamp idle injection driver" depends on THERMAL Loading Loading @@ -409,6 +419,11 @@ config MTK_THERMAL Enable this option if you want to have support for thermal management controller present in Mediatek SoCs menu "Broadcom thermal drivers" depends on ARCH_BCM || COMPILE_TEST source "drivers/thermal/broadcom/Kconfig" endmenu menu "Texas Instruments thermal drivers" depends on ARCH_HAS_BANDGAP || COMPILE_TEST depends on HAS_IOMEM Loading drivers/thermal/Makefile +2 −0 Original line number Diff line number Diff line Loading @@ -27,6 +27,7 @@ thermal_sys-$(CONFIG_CLOCK_THERMAL) += clock_cooling.o thermal_sys-$(CONFIG_DEVFREQ_THERMAL) += devfreq_cooling.o # platform thermal drivers obj-y += broadcom/ obj-$(CONFIG_QCOM_SPMI_TEMP_ALARM) += qcom-spmi-temp-alarm.o obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o obj-$(CONFIG_ROCKCHIP_THERMAL) += rockchip_thermal.o Loading @@ -42,6 +43,7 @@ obj-$(CONFIG_IMX_THERMAL) += imx_thermal.o obj-$(CONFIG_MAX77620_THERMAL) += max77620_thermal.o obj-$(CONFIG_QORIQ_THERMAL) += qoriq_thermal.o obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o obj-$(CONFIG_DA9062_THERMAL) += da9062-thermal.o obj-$(CONFIG_INTEL_POWERCLAMP) += intel_powerclamp.o obj-$(CONFIG_X86_PKG_TEMP_THERMAL) += x86_pkg_temp_thermal.o obj-$(CONFIG_INTEL_SOC_DTS_IOSF_CORE) += intel_soc_dts_iosf.o Loading Loading
Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt +28 −4 Original line number Diff line number Diff line Loading @@ -7,11 +7,35 @@ compatible: should be one of: "brcm,bcm2835-thermal", "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal" reg: Address range of the thermal registers. clocks: Phandle of the clock used by the thermal sensor. #thermal-sensor-cells: should be 0 (see thermal.txt) Example: thermal-zones { cpu_thermal: cpu-thermal { polling-delay-passive = <0>; polling-delay = <1000>; thermal-sensors = <&thermal>; trips { cpu-crit { temperature = <80000>; hysteresis = <0>; type = "critical"; }; }; coefficients = <(-538) 407000>; cooling-maps { }; }; }; thermal: thermal@7e212000 { compatible = "brcm,bcm2835-thermal"; reg = <0x7e212000 0x8>; clocks = <&clocks BCM2835_CLOCK_TSENS>; #thermal-sensor-cells = <0>; };
Documentation/devicetree/bindings/thermal/brcm,ns-thermal 0 → 100644 +37 −0 Original line number Diff line number Diff line * Broadcom Northstar Thermal This binding describes thermal sensor that is part of Northstar's DMU (Device Management Unit). Required properties: - compatible : Must be "brcm,ns-thermal" - reg : iomem address range of PVTMON registers - #thermal-sensor-cells : Should be <0> Example: thermal: thermal@1800c2c0 { compatible = "brcm,ns-thermal"; reg = <0x1800c2c0 0x10>; #thermal-sensor-cells = <0>; }; thermal-zones { cpu_thermal: cpu-thermal { polling-delay-passive = <0>; polling-delay = <1000>; coefficients = <(-556) 418000>; thermal-sensors = <&thermal>; trips { cpu-crit { temperature = <125000>; hysteresis = <0>; type = "critical"; }; }; cooling-maps { }; }; };
Documentation/devicetree/bindings/thermal/da9062-thermal.txt 0 → 100644 +36 −0 Original line number Diff line number Diff line * Dialog DA9062/61 TJUNC Thermal Module This module is part of the DA9061/DA9062. For more details about entire DA9062 and DA9061 chips see Documentation/devicetree/bindings/mfd/da9062.txt Junction temperature thermal module uses an interrupt signal to identify high THERMAL_TRIP_HOT temperatures for the PMIC device. Required properties: - compatible: should be one of the following valid compatible string lines: "dlg,da9061-thermal", "dlg,da9062-thermal" "dlg,da9062-thermal" Optional properties: - polling-delay-passive : Specify the polling period, measured in milliseconds, between thermal zone device update checks. Example: DA9062 pmic0: da9062@58 { thermal { compatible = "dlg,da9062-thermal"; polling-delay-passive = <3000>; }; }; Example: DA9061 using a fall-back compatible for the DA9062 onkey driver pmic0: da9061@58 { thermal { compatible = "dlg,da9061-thermal", "dlg,da9062-thermal"; polling-delay-passive = <3000>; }; };
drivers/thermal/Kconfig +15 −0 Original line number Diff line number Diff line Loading @@ -320,6 +320,16 @@ config DB8500_CPUFREQ_COOLING bound cpufreq cooling device turns active to set CPU frequency low to cool down the CPU. config DA9062_THERMAL tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" depends on MFD_DA9062 || COMPILE_TEST depends on OF help Enable this for the Dialog Semiconductor thermal sensor driver. This will report PMIC junction over-temperature for one thermal trip zone. Compatible with the DA9062 and DA9061 PMICs. config INTEL_POWERCLAMP tristate "Intel PowerClamp idle injection driver" depends on THERMAL Loading Loading @@ -409,6 +419,11 @@ config MTK_THERMAL Enable this option if you want to have support for thermal management controller present in Mediatek SoCs menu "Broadcom thermal drivers" depends on ARCH_BCM || COMPILE_TEST source "drivers/thermal/broadcom/Kconfig" endmenu menu "Texas Instruments thermal drivers" depends on ARCH_HAS_BANDGAP || COMPILE_TEST depends on HAS_IOMEM Loading
drivers/thermal/Makefile +2 −0 Original line number Diff line number Diff line Loading @@ -27,6 +27,7 @@ thermal_sys-$(CONFIG_CLOCK_THERMAL) += clock_cooling.o thermal_sys-$(CONFIG_DEVFREQ_THERMAL) += devfreq_cooling.o # platform thermal drivers obj-y += broadcom/ obj-$(CONFIG_QCOM_SPMI_TEMP_ALARM) += qcom-spmi-temp-alarm.o obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o obj-$(CONFIG_ROCKCHIP_THERMAL) += rockchip_thermal.o Loading @@ -42,6 +43,7 @@ obj-$(CONFIG_IMX_THERMAL) += imx_thermal.o obj-$(CONFIG_MAX77620_THERMAL) += max77620_thermal.o obj-$(CONFIG_QORIQ_THERMAL) += qoriq_thermal.o obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o obj-$(CONFIG_DA9062_THERMAL) += da9062-thermal.o obj-$(CONFIG_INTEL_POWERCLAMP) += intel_powerclamp.o obj-$(CONFIG_X86_PKG_TEMP_THERMAL) += x86_pkg_temp_thermal.o obj-$(CONFIG_INTEL_SOC_DTS_IOSF_CORE) += intel_soc_dts_iosf.o Loading