Commit 130aa61a authored Jun 11, 2009 by Stephen Hemminger Committed by David S. Miller Jun 11, 2009

bonding: fix multiple module load problem



Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787e
   Author: Jay Vosburgh <fubar@us.ibm.com>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>

parent 5ef12d98

drivers/net/bonding/bond_sysfs.c

+1 −0

Original line number	Diff line number	Diff line
		@@ -1541,6 +1541,7 @@ int bond_create_sysfs(void)
		printk(KERN_ERR
		"network device named %s already exists in sysfs",
		class_attr_bonding_masters.attr.name);
		ret = 0;
		}

		return ret;