Donate to e Foundation | Murena handsets with /e/OS | Own a part of Murena! Learn more

Commit cf272512 authored by Gopala Krishna Nuthaki's avatar Gopala Krishna Nuthaki
Browse files

dt-bindings: Add snapshot of RPM SMD devicetree binding 

Add snapshot of RPM SMD devicetree binding to the
devicetree project.This snapshot is taken as of
'commit <f7835e76aab01> ("drivers: thermal: Add support
for RPM SMD cooling device")' of the msm-4.14 kernel project.

Change-Id: Ib2fd5196575d3ae9cfd0276f5e4beb7f9057f46d
parent 6ae011df

bindings/thermal/qcom,rpm-smd-cdev.txt

0 → 100644
+27 −0
Original line number Diff line number Diff line 
Qualcomm Technologies, Inc. RPM SMD cooling device



The RPM shared memory(SMD) cooling device, will be used to set

different thermal band level to RPM hardware. When threshold violation

occurs, RPM SMD cooling device sends pre-configured thermal band level

to RPM hardware via SMD.



Required Parameters:

- compatible:

	Usage: required

	Value type: <string>

	Definition: should be "qcom,rpm-smd-cooling-device"



- #cooling-cells:

	Usage: required

	Value type: <integer>

	Definition: Must be 2. This is required by of-thermal and refer the doc

		<devicetree/bindings/thermal/thermal.txt> for more details.



Example:



&rpm_bus {

	rpm_smd_cdev: rpm-smd-cdev {

		compatible = "qcom,rpm-smd-cooling-device";

		#cooling-cells = <2>;

	};

};