ASoC: Intel: Skylake: Strip T and L from TLV IPCs (a8cd7066) · Commits · e / devices / android_kernel_fairphone_FP5

cAVS modules do not require Type and Length header within the set_module_params IPC. This is also true for Vendor modules. The userspace (like tinymix) always appends this header to TLV controls which are used for set_module_params. Simply assume this header is always present in the payload and omit it from the IPC. Signed-off-by:

Kamil Lulko <kamilx.lulko@intel.com> Signed-off-by:

Cezary Rojewski <cezary.rojewski@intel.com> Reviewed-by:

Pierre-Louis Bossart <pierre-louis.bossart@linux.intel.com> Signed-off-by:

Mark Brown <broonie@kernel.org>

sound/soc/intel/skylake/skl-topology.c

+9 −13

Original line number	Diff line number	Diff line
		@@ -1492,22 +1492,18 @@ static int skl_tplg_tlv_control_set(struct snd_kcontrol *kcontrol,
		struct skl *skl = get_skl_ctx(w->dapm->dev);

		if (ac->params) {
		/*
		* Widget data is expected to be stripped of T and L
		*/
		size -= 2 * sizeof(unsigned int);
		data += 2;

		if (size > ac->max)
		return -EINVAL;

		ac->size = size;
		/*
		* if the param_is is of type Vendor, firmware expects actual
		* parameter id and size from the control.
		*/
		if (ac->param_id == SKL_PARAM_VENDOR_ID) {

		if (copy_from_user(ac->params, data, size))
		return -EFAULT;
		} else {
		if (copy_from_user(ac->params,
		data + 2, size))
		return -EFAULT;
		}

		if (w->power)
		return skl_set_module_params(skl->skl_sst,