Merge "ARM: dts: msm: Add DDR cooling device for Lahaina"

QTI DDR cooling device.

The DDR cooling device will be used to place a DDR frequency vote. This

cooling device will be used in those cases where all the subsystem's are

thermally throttled and DDR has to be operated with a minimum performance

level. This cooling device vote can ensure the same.

Properties:

- compatible:

	Usage: required

	Value type: <string>

	Definition: should be "qcom,ddr-cooling-device"

Cooling device node:

- qcom,ddr-freq:

	Usage: required

	Value type: <u32 array>

	Definition: List of available DDR frequencies.

-#cooling-cells:

	Usage: required

	Value type: <integer>

	Definition: Must be 2. Needed for of_thermal as cooling device

			identifier. Please refer to

			<devicetree/bindings/thermal/thermal.txt> for more

			details.

Example:

	qcom,ddr-cdev {

		compatible = "qcom,ddr-cooling-device";

		qcom,ddr-freq = <200000>,

				<451000>,

				<547000>,

				<681000>,

				<768000>,

				<1017000>,

				<1555000>,

				<1708000>,

				<2092000>,

				<2736000>,

				<3196000>;

		#cooling-cells = <2>;

        };

		reg = <0x00635000 0x1000>;

		interrupts = <GIC_SPI 243 IRQ_TYPE_LEVEL_HIGH>;

	};

	ddr_cdev: qcom,ddr-cdev {

		compatible = "qcom,ddr-cooling-device";

		#cooling-cells = <2>;

		qcom,ddr-freq = <762000>,

				<1720000>,

				<2086000>,

				<2597000>,

				<2929000>,

				<3879000>,

				<5161000>,

				<5931000>,

				<6515000>,

				<7980000>,

				<8136000>,

				<10437000>,

				<12191000>;

		interconnects = <&mc_virt MASTER_LLCC &mc_virt SLAVE_EBI1>;

	};

};

&cpufreq_hw {

		thermal-governor = "step_wise";

		trips {

			pop_trip: pop-trip {

				temperature = <95000>;

				temperature = <90000>;

				hysteresis = <0>;

				type = "passive";

			};

					<&apc1_cluster THERMAL_NO_LIMIT

						THERMAL_NO_LIMIT>;

			};

			pop_cdev1 {

				trip = <&pop_trip>;

				cooling-device = <&ddr_cdev 5 5>;

			};

		};

	};