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Commit 14816b0f authored by Manaf Meethalavalappu Pallikunhi's avatar Manaf Meethalavalappu Pallikunhi
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dt-bindings: Add snapshot of RPM SMD devicetree binding 

Add snapshot of RPM SMD devicetree binding to the devicetree project.
This snapshot is taken as of 'commit <f7835e76aab01> ("drivers:
thermal: Add support for RPM SMD cooling device")' of the msm-4.19
kernel project.

Change-Id: I66e9017e88d28b1c1407cb3d3673ad41be1c280a
parent 96df30f1

bindings/thermal/qcom,rpm-smd-cdev.txt

0 → 100644
+27 −0
Original line number Diff line number Diff line 
Qualcomm Technologies, Inc. RPM SMD cooling device



The RPM shared memory(SMD) cooling device, will be used to set

different thermal band level to RPM hardware. When threshold violation

occurs, RPM SMD cooling device sends pre-configured thermal band level

to RPM hardware via SMD.



Required Parameters:

- compatible:

	Usage: required

	Value type: <string>

	Definition: should be "qcom,rpm-smd-cooling-device"



- #cooling-cells:

	Usage: required

	Value type: <integer>

	Definition: Must be 2. This is required by of-thermal and refer the doc

		<devicetree/bindings/thermal/thermal.txt> for more details.



Example:



&rpm_bus {

	rpm_smd_cdev: rpm-smd-cdev {

		compatible = "qcom,rpm-smd-cooling-device";

		#cooling-cells = <2>;

	};

};