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Commit 05ec8220 authored by David Dai's avatar David Dai
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dt-bindings: interconnect: add interconnect bindings 

Add interconnect device bindings. These devices can be used to
describe any RPMH and NoC based interconnect devices.

Change-Id: Iab822d4ced5aa015748ccbe464ffb616767a34c2
parent fb7773e1

bindings/interconnect/qcom,lahaina.txt

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Qualcomm Technologies, Inc. Lahaina Network-On-Chip interconnect driver binding

-----------------------------------------------------------



Lahaina interconnect providers support system bandwidth requirements through

RPMh hardware accelerators known as Bus Clock Manager (BCM). The provider is

able to communicate with the BCM through the Resource State Coordinator (RSC)

associated with each execution environment. Provider nodes must point to at

least one RPMh device child node pertaining to their RSC and each provider

can map to multiple RPMh resources.



Required properties :

- compatible : shall contain only one of the following:

			"qcom,lahaina-aggre1_noc",

			"qcom,lahaina-aggre2_noc",

			"qcom,lahaina-config_noc",

			"qcom,lahaina-dc_noc",

			"qcom,lahaina-gem_noc",

			"qcom,lahaina-lpass_ag_noc",

			"qcom,lahaina-mc_virt",

			"qcom,lahaina-mmss_noc",

			"qcom,lahaina-nsp_noc",

			"qcom,lahaina-system_noc",

- #interconnect-cells : should contain 1



Examples:



aggre1_noc: interconnect@16e0000 {

	compatible = "qcom,lahaina-aggre1_noc";

	interconnect-cells = <1>;

};