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Commit f8b72d36 authored by Rick Jones's avatar Rick Jones Committed by David S. Miller
Browse files

net-next: minor cleanups for bonding documentation 



The section titled "Configuring Bonding for Maximum Throughput" is
actually section twelve not thirteen, and there are a couple of words
spelled incorrectly.

Signed-off-by: default avatarRick Jones <rick.jones2@hp.com>
Reviewed-by: default avatarNicolas de Pesloüan <nicolas.2p.debian@free.fr>
Signed-off-by: default avatarJay Vosburgh <fubar@us.ibm.com>
Signed-off-by: default avatarDavid S. Miller <davem@davemloft.net>
parent 406a3c63

Documentation/networking/bonding.txt

+3 −3
Original line number Diff line number Diff line
@@ -1210,7 +1210,7 @@ options, you may wish to use the "max_bonds" module parameter, 
documented above.



	To create multiple bonding devices with differing options, it is

preferrable to use bonding parameters exported by sysfs, documented in the

preferable to use bonding parameters exported by sysfs, documented in the

section below.



	For versions of bonding without sysfs support, the only means to
@@ -1950,7 +1950,7 @@ access to fail over to. Additionally, the bonding load balance modes 
support link monitoring of their members, so if individual links fail,

the load will be rebalanced across the remaining devices.



	See Section 13, "Configuring Bonding for Maximum Throughput"

	See Section 12, "Configuring Bonding for Maximum Throughput"

for information on configuring bonding with one peer device.



11.2 High Availability in a Multiple Switch Topology
@@ -2620,7 +2620,7 @@ be found at: 


https://lists.sourceforge.net/lists/listinfo/bonding-devel



	Discussions regarding the developpement of the bonding driver take place

	Discussions regarding the development of the bonding driver take place

on the main Linux network mailing list, hosted at vger.kernel.org. The list

address is: