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Commit d2e4eb83 authored by Eduardo Valentin's avatar Eduardo Valentin Committed by Zhang Rui
Browse files

thermal: update kernel-doc for thermal_zone_bind_cooling_device 



This patch updates the documentation for thermal_zone_bind_cooling_device
and removes the warnings generated by scripts/kernel-doc -v.

Signed-off-by: default avatarEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: default avatarZhang Rui <rui.zhang@intel.com>
parent 910cb1e3

drivers/thermal/thermal_core.c

+13 −3
Original line number Diff line number Diff line
@@ -1109,13 +1109,23 @@ thermal_remove_hwmon_sysfs(struct thermal_zone_device *tz) 
#endif



/**

 * thermal_zone_bind_cooling_device - bind a cooling device to a thermal zone

 * @tz:		thermal zone device

 * thermal_zone_bind_cooling_device() - bind a cooling device to a thermal zone

 * @tz:		pointer to struct thermal_zone_device

 * @trip:	indicates which trip point the cooling devices is

 *		associated with in this thermal zone.

 * @cdev:	thermal cooling device

 * @cdev:	pointer to struct thermal_cooling_device

 * @upper:	the Maximum cooling state for this trip point.

 *		THERMAL_NO_LIMIT means no upper limit,

 *		and the cooling device can be in max_state.

 * @lower:	the Minimum cooling state can be used for this trip point.

 *		THERMAL_NO_LIMIT means no lower limit,

 *		and the cooling device can be in cooling state 0.

 *

 * This interface function bind a thermal cooling device to the certain trip

 * point of a thermal zone device.

 * This function is usually called in the thermal zone device .bind callback.

 *

 * Return: 0 on success, the proper error value otherwise.

 */

int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,

				     int trip,