+13
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drivers/usb/dwc3/dwc3-exynos.c
0 → 100644
+151
−0
+24
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Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by:Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by:
Felipe Balbi <balbi@ti.com>