Merge "power_supply: Use of-thermal cdev registration API" into msm-4.9 (e3493690) · Commits · e / devices / android_kernel_fairphone_FP3

drivers/power/supply/power_supply_core.c

+10 −4

Original line number	Diff line number	Diff line
		@@ -665,7 +665,7 @@ static struct thermal_cooling_device_ops psy_tcd_ops = {
		.set_cur_state = ps_set_cur_charge_cntl_limit,
		};

		static int psy_register_cooler(struct power_supply *psy)
		static int psy_register_cooler(struct device dev, struct power_supply psy)
		{
		int i;

		@@ -673,6 +673,12 @@ static int psy_register_cooler(struct power_supply *psy)
		for (i = 0; i < psy->desc->num_properties; i++) {
		if (psy->desc->properties[i] ==
		POWER_SUPPLY_PROP_CHARGE_CONTROL_LIMIT) {
		if (dev)
		psy->tcd = thermal_of_cooling_device_register(
		dev_of_node(dev),
		(char *)psy->desc->name,
		psy, &psy_tcd_ops);
		else
		psy->tcd = thermal_cooling_device_register(
		(char *)psy->desc->name,
		psy, &psy_tcd_ops);
		@@ -698,7 +704,7 @@ static void psy_unregister_thermal(struct power_supply *psy)
		{
		}

		static int psy_register_cooler(struct power_supply *psy)
		static int psy_register_cooler(struct device dev, struct power_supply psy)
		{
		return 0;
		}
		@@ -770,7 +776,7 @@ __power_supply_register(struct device *parent,
		if (rc)
		goto register_thermal_failed;

		rc = psy_register_cooler(psy);
		rc = psy_register_cooler(parent, psy);
		if (rc)
		goto register_cooler_failed;