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Commit aea8928a authored by Jean Delvare's avatar Jean Delvare Committed by Felipe Balbi
Browse files

usb: dwc3: add glue layer dependencies 



Glue layers for the DWC3 driver only make sense on specific platforms.
Add dependencies so that they are not built where they aren't needed.

Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: WingMan Kwok <w-kwok2@ti.com>
Signed-off-by: default avatarJean Delvare <jdelvare@suse.de>
Signed-off-by: default avatarFelipe Balbi <balbi@ti.com>
parent 1d57de30

drivers/usb/dwc3/Kconfig

+3 −1
Original line number Diff line number Diff line
@@ -44,7 +44,7 @@ comment "Platform Glue Driver Support" 


config USB_DWC3_OMAP

	tristate "Texas Instruments OMAP5 and similar Platforms"

	depends on EXTCON

	depends on EXTCON && (ARCH_OMAP2PLUS || COMPILE_TEST)

	default USB_DWC3

	help

	  Some platforms from Texas Instruments like OMAP5, DRA7xxx and
@@ -54,6 +54,7 @@ config USB_DWC3_OMAP 


config USB_DWC3_EXYNOS

	tristate "Samsung Exynos Platform"

	depends on ARCH_EXYNOS || COMPILE_TEST

	default USB_DWC3

	help

	  Recent Exynos5 SoCs ship with one DesignWare Core USB3 IP inside,
@@ -72,6 +73,7 @@ config USB_DWC3_PCI 


config USB_DWC3_KEYSTONE

	tristate "Texas Instruments Keystone2 Platforms"

	depends on ARCH_KEYSTONE || COMPILE_TEST

	default USB_DWC3

	help

	  Support of USB2/3 functionality in TI Keystone2 platforms.