Merge branches 'thermal-core', 'thermal-intel' and 'thermal-soc' into next (88ac9906) · Commits · e / devices / android_kernel_fairphone_FP3

Documentation/devicetree/bindings/thermal/rcar-thermal.txt

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Original line number	Original line	Diff line number	Diff line
	@@ -11,7 +11,6 @@ Required properties:
	- "renesas,thermal-r8a7791" (R-Car M2-W)		- "renesas,thermal-r8a7791" (R-Car M2-W)
	- "renesas,thermal-r8a7792" (R-Car V2H)		- "renesas,thermal-r8a7792" (R-Car V2H)
	- "renesas,thermal-r8a7793" (R-Car M2-N)		- "renesas,thermal-r8a7793" (R-Car M2-N)
	- "renesas,thermal-r8a7794" (R-Car E2)
	- reg : Address range of the thermal registers.		- reg : Address range of the thermal registers.
	The 1st reg will be recognized as common register		The 1st reg will be recognized as common register
	if it has "interrupts".		if it has "interrupts".

Documentation/devicetree/bindings/thermal/tango-thermal.txt

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Original line number	Original line	Diff line number	Diff line
			* Tango Thermal

			The SMP8758 SoC includes 3 instances of this temperature sensor
			(in the CPU, video decoder, and PCIe controller).

			Required properties:
			- #thermal-sensor-cells: Should be 0 (see thermal.txt)
			- compatible: "sigma,smp8758-thermal"
			- reg: Address range of the thermal registers

			Example:

			cpu_temp: thermal@920100 {
			#thermal-sensor-cells = <0>;
			compatible = "sigma,smp8758-thermal";
			reg = <0x920100 12>;
			};

Documentation/devicetree/bindings/thermal/tegra-soctherm.txt

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Original line number	Original line	Diff line number	Diff line
	@@ -26,6 +26,10 @@ Required properties :
	of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a		of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
	list of valid values when referring to thermal sensors.		list of valid values when referring to thermal sensors.

			Note:
			- the "critical" type trip points will be set to SOC_THERM hardware as the
			shut down temperature. Once the temperature of this thermal zone is higher
			than it, the system will be shutdown or reset by hardware.

	Example :		Example :

	@@ -51,5 +55,13 @@ Example: referring to thermal sensors :

	thermal-sensors =		thermal-sensors =
	<&soctherm TEGRA124_SOCTHERM_SENSOR_CPU>;		<&soctherm TEGRA124_SOCTHERM_SENSOR_CPU>;

			trips {
			cpu_shutdown_trip: shutdown-trip {
			temperature = <102500>;
			hysteresis = <1000>;
			type = "critical";
			};
			};
	};		};
	};		};

Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt

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Original line number	Original line	Diff line number	Diff line
			General Purpose Analog To Digital Converter (ADC) based thermal sensor.

			On some of platforms, thermal sensor like thermistors are connected to
			one of ADC channel and sensor resistance is read via voltage across the
			sensor resistor. The voltage read across the sensor is mapped to
			temperature using voltage-temperature lookup table.

			Required properties:
			===================
			- compatible: Must be "generic-adc-thermal".
			- temperature-lookup-table: Two dimensional array of Integer; lookup table
			to map the relation between ADC value and
			temperature. When ADC is read, the value is
			looked up on the table to get the equivalent
			temperature.
			The first value of the each row of array is the
			temperature in milliCelsius and second value of
			the each row of array is the ADC read value.
			- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description
			of this property.

			Example :
			#include <dt-bindings/thermal/thermal.h>

			i2c@7000c400 {
			ads1015: ads1015@4a {
			reg = <0x4a>;
			compatible = "ads1015";
			sampling-frequency = <3300>;
			#io-channel-cells = <1>;
			};
			};

			tboard_thermistor: thermal-sensor {
			compatible = "generic-adc-thermal";
			#thermal-sensor-cells = <0>;
			io-channels = <&ads1015 1>;
			io-channel-names = "sensor-channel";
			temperature-lookup-table = < (-40000) 2578
			(-39000) 2577
			(-38000) 2576
			(-37000) 2575
			(-36000) 2574
			(-35000) 2573
			(-34000) 2572
			(-33000) 2571
			(-32000) 2569
			(-31000) 2568
			(-30000) 2567
			::::::::::
			118000 254
			119000 247
			120000 240
			121000 233
			122000 226
			123000 220
			124000 214
			125000 208>;
			};

			dummy_cool_dev: dummy-cool-dev {
			compatible = "dummy-cooling-dev";
			#cooling-cells = <2>; /* min followed by max */
			};

			thermal-zones {
			Tboard {
			polling-delay = <15000>; /* milliseconds */
			polling-delay-passive = <0>; /* milliseconds */
			thermal-sensors = <&tboard_thermistor>;

			trips {
			therm_est_trip: therm_est_trip {
			temperature = <40000>;
			type = "active";
			hysteresis = <1000>;
			};
			};

			cooling-maps {
			map0 {
			trip = <&therm_est_trip>;
			cooling-device = <&dummy_cool_dev THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
			contribution = <100>;
			};

			};
			};
			};

Documentation/thermal/sysfs-api.txt

+22 −22

Original line number	Original line	Diff line number	Diff line
	@@ -69,8 +69,8 @@ temperature) and throttle appropriate devices.
	1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)		1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)

	This interface function removes the thermal zone device.		This interface function removes the thermal zone device.
	It deletes the corresponding entry form /sys/class/thermal folder and		It deletes the corresponding entry from /sys/class/thermal folder and
	unbind all the thermal cooling devices it uses.		unbinds all the thermal cooling devices it uses.

	1.1.3 struct thermal_zone_device *thermal_zone_of_sensor_register(		1.1.3 struct thermal_zone_device *thermal_zone_of_sensor_register(
	struct device dev, int sensor_id, void data,		struct device dev, int sensor_id, void data,
	@@ -146,32 +146,32 @@ temperature) and throttle appropriate devices.

	This interface function adds a new thermal cooling device (fan/processor/...)		This interface function adds a new thermal cooling device (fan/processor/...)
	to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself		to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself
	to all the thermal zone devices register at the same time.		to all the thermal zone devices registered at the same time.
	name: the cooling device name.		name: the cooling device name.
	devdata: device private data.		devdata: device private data.
	ops: thermal cooling devices call-backs.		ops: thermal cooling devices call-backs.
	.get_max_state: get the Maximum throttle state of the cooling device.		.get_max_state: get the Maximum throttle state of the cooling device.
	.get_cur_state: get the Current throttle state of the cooling device.		.get_cur_state: get the Currently requested throttle state of the cooling device.
	.set_cur_state: set the Current throttle state of the cooling device.		.set_cur_state: set the Current throttle state of the cooling device.

	1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)		1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)

	This interface function remove the thermal cooling device.		This interface function removes the thermal cooling device.
	It deletes the corresponding entry form /sys/class/thermal folder and		It deletes the corresponding entry from /sys/class/thermal folder and
	unbind itself from all the thermal zone devices using it.		unbinds itself from all the thermal zone devices using it.

	1.3 interface for binding a thermal zone device with a thermal cooling device		1.3 interface for binding a thermal zone device with a thermal cooling device
	1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,		1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
	int trip, struct thermal_cooling_device *cdev,		int trip, struct thermal_cooling_device *cdev,
	unsigned long upper, unsigned long lower, unsigned int weight);		unsigned long upper, unsigned long lower, unsigned int weight);

	This interface function bind a thermal cooling device to the certain trip		This interface function binds a thermal cooling device to a particular trip
	point of a thermal zone device.		point of a thermal zone device.
	This function is usually called in the thermal zone device .bind callback.		This function is usually called in the thermal zone device .bind callback.
	tz: the thermal zone device		tz: the thermal zone device
	cdev: thermal cooling device		cdev: thermal cooling device
	trip: indicates which trip point the cooling devices is associated with		trip: indicates which trip point in this thermal zone the cooling device
	in this thermal zone.		is associated with.
	upper:the Maximum cooling state for this trip point.		upper:the Maximum cooling state for this trip point.
	THERMAL_NO_LIMIT means no upper limit,		THERMAL_NO_LIMIT means no upper limit,
	and the cooling device can be in max_state.		and the cooling device can be in max_state.
	@@ -184,13 +184,13 @@ temperature) and throttle appropriate devices.
	1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,		1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
	int trip, struct thermal_cooling_device *cdev);		int trip, struct thermal_cooling_device *cdev);

	This interface function unbind a thermal cooling device from the certain		This interface function unbinds a thermal cooling device from a particular
	trip point of a thermal zone device. This function is usually called in		trip point of a thermal zone device. This function is usually called in
	the thermal zone device .unbind callback.		the thermal zone device .unbind callback.
	tz: the thermal zone device		tz: the thermal zone device
	cdev: thermal cooling device		cdev: thermal cooling device
	trip: indicates which trip point the cooling devices is associated with		trip: indicates which trip point in this thermal zone the cooling device
	in this thermal zone.		is associated with.

	1.4 Thermal Zone Parameters		1.4 Thermal Zone Parameters
	1.4.1 struct thermal_bind_params		1.4.1 struct thermal_bind_params
	@@ -210,13 +210,13 @@ temperature) and throttle appropriate devices.
	this thermal zone and cdev, for a particular trip point.		this thermal zone and cdev, for a particular trip point.
	If nth bit is set, then the cdev and thermal zone are bound		If nth bit is set, then the cdev and thermal zone are bound
	for trip point n.		for trip point n.
	.limits: This is an array of cooling state limits. Must have exactly		.binding_limits: This is an array of cooling state limits. Must have
	2 * thermal_zone.number_of_trip_points. It is an array consisting		exactly 2 * thermal_zone.number_of_trip_points. It is an
	of tuples <lower-state upper-state> of state limits. Each trip		array consisting of tuples <lower-state upper-state> of
	will be associated with one state limit tuple when binding.		state limits. Each trip will be associated with one state
	A NULL pointer means <THERMAL_NO_LIMITS THERMAL_NO_LIMITS>		limit tuple when binding. A NULL pointer means
	on all trips. These limits are used when binding a cdev to a		<THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips.
	trip point.		These limits are used when binding a cdev to a trip point.
	.match: This call back returns success(0) if the 'tz and cdev' need to		.match: This call back returns success(0) if the 'tz and cdev' need to
	be bound, as per platform data.		be bound, as per platform data.
	1.4.2 struct thermal_zone_params		1.4.2 struct thermal_zone_params
	@@ -351,8 +351,8 @@ cdev[0-*]
	RO, Optional		RO, Optional

	cdev[0-*]_trip_point		cdev[0-*]_trip_point
	The trip point with which cdev[0-*] is associated in this thermal		The trip point in this thermal zone which cdev[0-*] is associated
	zone; -1 means the cooling device is not associated with any trip		with; -1 means the cooling device is not associated with any trip
	point.		point.
	RO, Optional		RO, Optional