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Commit 83a9fb20 authored by Mark Rustad's avatar Mark Rustad Committed by Jeff Kirsher
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ixgbe: Add support for newer thermal alarm 



The newer copper PHY implementation used with newer X550EM_x
devices uses a different thermal alarm type than the earlier
one. Make changes to support both types.

Signed-off-by: default avatarMark Rustad <mark.d.rustad@intel.com>
Tested-by: default avatarDarin Miller <darin.j.miller@intel.com>
Signed-off-by: default avatarJeff Kirsher <jeffrey.t.kirsher@intel.com>
parent f164b845

drivers/net/ethernet/intel/ixgbe/ixgbe_type.h

+4 −0
Original line number Diff line number Diff line
@@ -1345,7 +1345,10 @@ struct ixgbe_thermal_sensor_data { 
#define IXGBE_MDIO_GLOBAL_INT_CHIP_VEN_MASK	0xFF01 /* int chip-wide mask */

#define IXGBE_MDIO_GLOBAL_INT_CHIP_VEN_FLAG	0xFC01 /* int chip-wide mask */

#define IXGBE_MDIO_GLOBAL_ALARM_1		0xCC00 /* Global alarm 1 */

#define IXGBE_MDIO_GLOBAL_ALM_1_DEV_FAULT	0x0010 /* device fault */

#define IXGBE_MDIO_GLOBAL_ALM_1_HI_TMP_FAIL	0x4000 /* high temp failure */

#define IXGBE_MDIO_GLOBAL_FAULT_MSG		0xC850 /* global fault msg */

#define IXGBE_MDIO_GLOBAL_FAULT_MSG_HI_TMP	0x8007 /* high temp failure */

#define IXGBE_MDIO_GLOBAL_INT_MASK		0xD400 /* Global int mask */

/* autoneg vendor alarm int enable */

#define IXGBE_MDIO_GLOBAL_AN_VEN_ALM_INT_EN	0x1000
@@ -1353,6 +1356,7 @@ struct ixgbe_thermal_sensor_data { 
#define IXGBE_MDIO_GLOBAL_VEN_ALM_INT_EN	0x1 /* vendor alarm int enable */

#define IXGBE_MDIO_GLOBAL_STD_ALM2_INT		0x200 /* vendor alarm2 int mask */

#define IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN	0x4000 /* int high temp enable */

#define IXGBE_MDIO_GLOBAL_INT_DEV_FAULT_EN	0x0010 /*int dev fault enable */



#define IXGBE_MDIO_PMA_PMD_SDA_SCL_ADDR	0xC30A /* PHY_XS SDA/SCL Addr Reg */

#define IXGBE_MDIO_PMA_PMD_SDA_SCL_DATA	0xC30B /* PHY_XS SDA/SCL Data Reg */

drivers/net/ethernet/intel/ixgbe/ixgbe_x550.c

+19 −3
Original line number Diff line number Diff line
@@ -1444,7 +1444,7 @@ static s32 ixgbe_get_lasi_ext_t_x550em(struct ixgbe_hw *hw, bool *lsc) 
				IXGBE_MDIO_GLOBAL_ALARM_1_INT)))

		return status;



	/* High temperature failure alarm triggered */

	/* Global alarm triggered */

	status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_ALARM_1,

				      IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,

				      &reg);
@@ -1458,6 +1458,21 @@ static s32 ixgbe_get_lasi_ext_t_x550em(struct ixgbe_hw *hw, bool *lsc) 
		ixgbe_set_copper_phy_power(hw, false);

		return IXGBE_ERR_OVERTEMP;

	}

	if (reg & IXGBE_MDIO_GLOBAL_ALM_1_DEV_FAULT) {

		/*  device fault alarm triggered */

		status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_FAULT_MSG,

					  IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,

					  &reg);

		if (status)

			return status;



		/* if device fault was due to high temp alarm handle and exit */

		if (reg == IXGBE_MDIO_GLOBAL_FAULT_MSG_HI_TMP) {

			/* power down the PHY in case the PHY FW didn't */

			ixgbe_set_copper_phy_power(hw, false);

			return IXGBE_ERR_OVERTEMP;

		}

	}



	/* Vendor alarm 2 triggered */

	status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_CHIP_STD_INT_FLAG,
@@ -1511,14 +1526,15 @@ static s32 ixgbe_enable_lasi_ext_t_x550em(struct ixgbe_hw *hw) 
	if (status)

		return status;



	/* Enables high temperature failure alarm */

	/* Enable high temperature failure and global fault alarms */

	status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_INT_MASK,

				      IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,

				      &reg);

	if (status)

		return status;



	reg |= IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN;

	reg |= (IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN |

		IXGBE_MDIO_GLOBAL_INT_DEV_FAULT_EN);



	status = hw->phy.ops.write_reg(hw, IXGBE_MDIO_GLOBAL_INT_MASK,

				       IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,