the generic thermal sysfs driver (203d3d4a) · Commits · e / devices / android_kernel_fairphone_FP3

Documentation/thermal/sysfs-api.txt

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		Generic Thermal Sysfs driver How To
		=========================

		Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>

		Updated: 2 January 2008

		Copyright (c) 2008 Intel Corporation


		0. Introduction

		The generic thermal sysfs provides a set of interfaces for thermal zone devices (sensors)
		and thermal cooling devices (fan, processor...) to register with the thermal management
		solution and to be a part of it.

		This how-to focusses on enabling new thermal zone and cooling devices to participate
		in thermal management.
		This solution is platform independent and any type of thermal zone devices and
		cooling devices should be able to make use of the infrastructure.

		The main task of the thermal sysfs driver is to expose thermal zone attributes as well
		as cooling device attributes to the user space.
		An intelligent thermal management application can make decisions based on inputs
		from thermal zone attributes (the current temperature and trip point temperature)
		and throttle appropriate devices.

		[0-*] denotes any positive number starting from 0
		[1-*] denotes any positive number starting from 1

		1. thermal sysfs driver interface functions

		1.1 thermal zone device interface
		1.1.1 struct thermal_zone_device thermal_zone_device_register(char name, int trips,
		void devdata, struct thermal_zone_device_ops ops)

		This interface function adds a new thermal zone device (sensor) to
		/sys/class/thermal folder as thermal_zone[0-*].
		It tries to bind all the thermal cooling devices registered at the same time.

		name: the thermal zone name.
		trips: the total number of trip points this thermal zone supports.
		devdata: device private data
		ops: thermal zone device callbacks.
		.bind: bind the thermal zone device with a thermal cooling device.
		.unbind: unbing the thermal zone device with a thermal cooling device.
		.get_temp: get the current temperature of the thermal zone.
		.get_mode: get the current mode (user/kernel) of the thermal zone.
		"kernel" means thermal management is done in kernel.
		"user" will prevent kernel thermal driver actions upon trip points
		so that user applications can take charge of thermal management.
		.set_mode: set the mode (user/kernel) of the thermal zone.
		.get_trip_type: get the type of certain trip point.
		.get_trip_temp: get the temperature above which the certain trip point
		will be fired.

		1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)

		This interface function removes the thermal zone device.
		It deletes the corresponding entry form /sys/class/thermal folder and unbind all
		the thermal cooling devices it uses.

		1.2 thermal cooling device interface
		1.2.1 struct thermal_cooling_device thermal_cooling_device_register(char name,
		void devdata, struct thermal_cooling_device_ops )

		This interface function adds a new thermal cooling device (fan/processor/...) to
		/sys/class/thermal/ folder as cooling_device[0-*].
		It tries to bind itself to all the thermal zone devices register at the same time.
		name: the cooling device name.
		devdata: device private data.
		ops: thermal cooling devices callbacks.
		.get_max_state: get the Maximum throttle state of the cooling device.
		.get_cur_state: get the Current throttle state of the cooling device.
		.set_cur_state: set the Current throttle state of the cooling device.

		1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)

		This interface function remove the thermal cooling device.
		It deletes the corresponding entry form /sys/class/thermal folder and unbind
		itself from all the thermal zone devices using it.

		1.3 interface for binding a thermal zone device with a thermal cooling device
		1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
		int trip, struct thermal_cooling_device *cdev);

		This interface function bind a thermal cooling device to the certain trip point
		of a thermal zone device.
		This function is usually called in the thermal zone device .bind callback.
		tz: the thermal zone device
		cdev: thermal cooling device
		trip: indicates which trip point the cooling devices is associated with
		in this thermal zone.

		1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
		int trip, struct thermal_cooling_device *cdev);

		This interface function unbind a thermal cooling device from the certain trip point
		of a thermal zone device.
		This function is usually called in the thermal zone device .unbind callback.
		tz: the thermal zone device
		cdev: thermal cooling device
		trip: indicates which trip point the cooling devices is associated with
		in this thermal zone.

		2. sysfs attributes structure

		RO read only value
		RW read/write value

		All thermal sysfs attributes will be represented under /sys/class/thermal
		/sys/class/thermal/

		Thermal zone device sys I/F, created once it's registered:
		\|thermal_zone[0-*]:
		\|-----type: Type of the thermal zone
		\|-----temp: Current temperature
		\|-----mode: Working mode of the thermal zone
		\|-----trip_point_[0-*]_temp: Trip point temperature
		\|-----trip_point_[0-*]_type: Trip point type

		Thermal cooling device sys I/F, created once it's registered:
		\|cooling_device[0-*]:
		\|-----type : Type of the cooling device(processor/fan/...)
		\|-----max_state: Maximum cooling state of the cooling device
		\|-----cur_state: Current cooling state of the cooling device


		These two dynamic attributes are created/removed in pairs.
		They represent the relationship between a thermal zone and its associated cooling device.
		They are created/removed for each
		thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful exection.

		\|thermal_zone[0-*]
		\|-----cdev[0-]: The [0-]th cooling device in the current thermal zone
		\|-----cdev[0-]_trip_point: Trip point that cdev[0-] is associated with


		***************************
		* Thermal zone attributes *
		***************************

		type Strings which represent the thermal zone type.
		This is given by thermal zone driver as part of registration.
		Eg: "ACPI thermal zone" indicates it's a ACPI thermal device
		RO
		Optional

		temp Current temperature as reported by thermal zone (sensor)
		Unit: degree celsius
		RO
		Required

		mode One of the predifned values in [kernel, user]
		This file gives information about the algorithm
		that is currently managing the thermal zone.
		It can be either default kernel based algorithm
		or user space application.
		RW
		Optional
		kernel = Thermal management in kernel thermal zone driver.
		user = Preventing kernel thermal zone driver actions upon
		trip points so that user application can take full
		charge of the thermal management.

		trip_point_[0-*]_temp The temperature above which trip point will be fired
		Unit: degree celsius
		RO
		Optional

		trip_point_[0-*]_type Strings which indicate the type of the trip point
		Eg. it can be one of critical, hot, passive,
		active[0-*] for ACPI thermal zone.
		RO
		Optional

		cdev[0-*] Sysfs link to the thermal cooling device node where the sys I/F
		for cooling device throttling control represents.
		RO
		Optional

		cdev[0-]_trip_point The trip point with which cdev[0-] is assocated in this thermal zone
		-1 means the cooling device is not associated with any trip point.
		RO
		Optional

		******************************
		* Cooling device attributes *
		******************************

		type String which represents the type of device
		eg: For generic ACPI: this should be "Fan",
		"Processor" or "LCD"
		eg. For memory controller device on intel_menlow platform:
		this should be "Memory controller"
		RO
		Optional

		max_state The maximum permissible cooling state of this cooling device.
		RO
		Required

		cur_state The current cooling state of this cooling device.
		the value can any integer numbers between 0 and max_state,
		cur_state == 0 means no cooling
		cur_state == max_state means the maximum cooling.
		RW
		Required

		3. A simple implementation

		ACPI thermal zone may support multiple trip points like critical/hot/passive/active.
		If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time,
		it may register itself as a thermale_zone_device (thermal_zone1) with 4 trip points in all.
		It has one processor and one fan, which are both registered as thermal_cooling_device.
		If the processor is listed in _PSL method, and the fan is listed in _AL0 method,
		the sys I/F structure will be built like this:

		/sys/class/thermal:

		\|thermal_zone1:
		\|-----type: ACPI thermal zone
		\|-----temp: 37
		\|-----mode: kernel
		\|-----trip_point_0_temp: 100
		\|-----trip_point_0_type: critical
		\|-----trip_point_1_temp: 80
		\|-----trip_point_1_type: passive
		\|-----trip_point_2_temp: 70
		\|-----trip_point_2_type: active[0]
		\|-----trip_point_3_temp: 60
		\|-----trip_point_3_type: active[1]
		\|-----cdev0: --->/sys/class/thermal/cooling_device0
		\|-----cdev0_trip_point: 1 /* cdev0 can be used for passive */
		\|-----cdev1: --->/sys/class/thermal/cooling_device3
		\|-----cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/

		\|cooling_device0:
		\|-----type: Processor
		\|-----max_state: 8
		\|-----cur_state: 0

		\|cooling_device3:
		\|-----type: Fan
		\|-----max_state: 2
		\|-----cur_state: 0

drivers/Kconfig

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		@@ -58,6 +58,8 @@ source "drivers/power/Kconfig"

		source "drivers/hwmon/Kconfig"

		source "drivers/thermal/Kconfig"

		source "drivers/watchdog/Kconfig"

		source "drivers/ssb/Kconfig"

drivers/Makefile

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		@@ -64,6 +64,7 @@ obj-y += i2c/
		obj-$(CONFIG_W1) += w1/
		obj-$(CONFIG_POWER_SUPPLY) += power/
		obj-$(CONFIG_HWMON) += hwmon/
		obj-$(CONFIG_THERMAL) += thermal/
		obj-$(CONFIG_WATCHDOG) += watchdog/
		obj-$(CONFIG_PHONE) += telephony/
		obj-$(CONFIG_MD) += md/

drivers/thermal/Kconfig

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		#
		# Generic thermal sysfs drivers configuration
		#

		menuconfig THERMAL
		bool "Generic Thermal sysfs driver"
		default y
		help
		Generic Thermal Sysfs driver offers a generic mechanism for
		thermal management. Usually it's made up of one or more thermal
		zone and cooling device.
		each thermal zone contains its own temperature, trip points,
		cooling devices.
		All platforms with ACPI thermal support can use this driver.
		If you want this support, you should say Y here

drivers/thermal/Makefile

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		#
		# Makefile for sensor chip drivers.
		#

		obj-$(CONFIG_THERMAL) += thermal.o